Probe Stations manuale, semiautomatica e completamente automatica tipo vuoto alta e bassa temperatura, macchina di riparazione laser LCD / OLED.
RF Probes
Multicontact Probe
Probe card
Selective Die Sorter
Visual Inspection system
Wafer inspection system
Lithography
Atomic Layer Deposition sputtering
MBE Technology
MOCVD Systems
Dicing and Lapping Systems
Deposition (E-Beam – PECVD – Sputtering)
ION Etching
Growth (ALD – Plasma MOCVD – MOCVD)
Cleaning (Wet/Dry Cleaning – Plasma)
Space Simulation for satellite in ultravacuum
QuantumScope™ Failure Analysis
Miscroscope Systems:
– emmi™ Photoemission Microscopy
– XIVA™ LSIM Laser Signal Injection Microscopy
– Thermal-HS MWIR Hot Spot Detection Microscopy
– XIVA™ LSIM (Laser Signal Injection Microscopy)
– Thermal-HS Infrared Hot Spot Detection Microscopy
– InfraScope™ MWIR Temperature Mapping Microscope
– T°Imager™ Thermoreflectance Temperature Mapping Solution
Microscopy Services:
– QFI offers temperature mapping services, as well as Failure Analysis/IC
– Debug services utilizing
– InfraScope™ and QuantumScope™ systems
Vector Network Analyzers
– Tester di sicurezza
– Hipot Tester
– Dielettrimetro
– Megohmmetro
– Microhmmetro
– Milliohmmeter
3D Magnetic Mapper – Hall effect Probe
Brockhaus è un produttore leader a livello internazionale di dispositivi e sistemi di strumentazione per il controllo della qualità e l’esame dei materiali magnetici. Le misurazioni di tutte le proprietà magnetiche vengono eseguite in conformità con gli standard internazionali.
– Potenziostati
– Potentiostat
– Galvanostat / EIS
– Battery Cycling / Testing
– Scanning proble
– Workstation
– Spectrometer
– Microplate Reader
– Impedance analyzer &
– Temperature control unit
– FRA based conductimeter
– Quartz Crystal
– Microbalance
– Stopped-fow / Quenchflow
– Impedance Analyzer
– High Frequency LCR Meter
– High Frequency DC Bias
– Precision Component Analyzer
– Precision Magnetics Analyzer
Prodotti a Radiofrequenza per Telecomunicazioni Amplificatori RF
RF Power Amplifier
il leader mondiale nei test di affidabilità dei semiconduttori composti,fornisce test dinamici, multidimensionali, RF, CC e di temperatura su un’unica piattaforma attraverso una potente interfaccia utente grafica – RF – DC – Power device reliability – Test systems – Burn in
- Oscilloscopi per PC
- Analizzatori (VNA)
- Signal Injectors
X-ray and CT systems
Flip Chip bonding
Gold Bonding Wire Gold Alloy Bonding Wire Copper Bonding Wire Aluminum Bonding Wire Aluminum Bonding Ribbon Aluminum-Silicon Bonding Wire Silver Alloy Bonding Wire
DIE BONDING
EUTECTIC DIE BONDING
EPOXY DIE BONDING
GLOVEBOX
Glovebox with purification system
Wire bonders
Ball bonders
Pull testing
3D Wafer Bump & Wire Bonding AOI Inspection system
Wet Process Equipment
Factory Automation Software
DI Water ESD/ pH Controls
Bulk Chemical Dispense and Mixing
DI Heating Systems
Chemical Waste Collection
Founded in 1992, the company provides solutions
for Assembly, Nano-microelectronic
and Opto-electronic.
Chip Bonding Tools
Bonding Capillaries
Die Bonding Tools
Flip Chip Handling Tools
Wedge Bonding Tools
Technical Overview
Small Wire Bonding Tools
Large Wire Bonding Tools
Ribbon Wire Bonding Tool
Single Point-TAB Bonding Tools
Special Bonding Tools
Feel free to contact me for further information.
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Micro Elettronica Industria 4.0
Intercettiamo ogni specifico bisogno di mercato, impiegando le tecnologie più aggiornate e
mettendo a frutto un'expertise acquisita in anni di leadership nel settore.