Micro Elettronica Industria 4.0

Probe Stations manuale, semiautomatica e completamente automatica tipo vuoto alta e bassa temperatura, macchina di riparazione laser LCD / OLED.

RF Probes
Multicontact Probe
Probe card

Selective Die Sorter
Visual Inspection system

Wafer inspection system
Lithography
Atomic Layer Deposition sputtering
MBE Technology
MOCVD Systems
Dicing and Lapping Systems

Deposition (E-Beam – PECVD – Sputtering)
ION Etching
Growth (ALD – Plasma MOCVD – MOCVD)
Cleaning (Wet/Dry Cleaning – Plasma)
Space Simulation for satellite in ultravacuum

QuantumScope™ Failure Analysis

Miscroscope Systems:
– emmi™ Photoemission Microscopy
– XIVA™ LSIM Laser Signal Injection Microscopy
– Thermal-HS MWIR Hot Spot Detection Microscopy
– XIVA™ LSIM (Laser Signal Injection Microscopy)
– Thermal-HS Infrared Hot Spot Detection Microscopy
– InfraScope™ MWIR Temperature Mapping Microscope
– T°Imager™ Thermoreflectance Temperature Mapping Solution

Microscopy Services:
– QFI offers temperature mapping services, as well as Failure Analysis/IC
– Debug services utilizing
– InfraScope™ and QuantumScope™ systems

Vector Network Analyzers

– Tester di sicurezza
– Hipot Tester
– Dielettrimetro
– Megohmmetro
– Microhmmetro
– Milliohmmeter

3D Magnetic Mapper – Hall effect Probe

Brockhaus è un produttore leader a livello internazionale di dispositivi e sistemi di strumentazione per il controllo della qualità e l’esame dei materiali magnetici. Le misurazioni di tutte le proprietà magnetiche vengono eseguite in conformità con gli standard internazionali.

– Potenziostati
– Potentiostat
– Galvanostat / EIS
– Battery Cycling / Testing
– Scanning proble
– Workstation
– Spectrometer
– Microplate Reader
– Impedance analyzer &
– Temperature control unit
– FRA based conductimeter
– Quartz Crystal
– Microbalance
– Stopped-fow / Quenchflow

– Impedance Analyzer
– High Frequency LCR Meter
– High Frequency DC Bias
– Precision Component Analyzer
– Precision Magnetics Analyzer

Prodotti a Radiofrequenza per Telecomunicazioni                                    Amplificatori RF

RF Power Amplifier

il leader mondiale nei test di affidabilità dei semiconduttori composti,fornisce test dinamici, multidimensionali, RF, CC e di temperatura su un’unica piattaforma attraverso una potente interfaccia utente grafica – RF – DC – Power device reliability – Test systems – Burn in

• Oscilloscopi per PC
• Analizzatori (VNA)
• Signal Injectors

X-ray and CT systems

Flip Chip bonding

Gold Bonding Wire Gold Alloy Bonding Wire Copper Bonding Wire Aluminum Bonding Wire Aluminum Bonding Ribbon Aluminum-Silicon Bonding Wire Silver Alloy Bonding Wire

DIE BONDING
EUTECTIC DIE BONDING
EPOXY DIE BONDING

GLOVEBOX

Glovebox with purification system

Wire bonders
Ball bonders
Pull testing

3D Wafer Bump & Wire Bonding AOI Inspection system

Wet Process Equipment
Factory Automation Software
DI Water ESD/ pH Controls
Bulk Chemical Dispense and Mixing
DI Heating Systems
Chemical Waste Collection

Founded in 1992, the company provides solutions
for Assembly, Nano-microelectronic
and Opto-electronic.

Chip Bonding Tools
Bonding Capillaries
Die Bonding Tools
Flip Chip Handling Tools
Wedge Bonding Tools
Technical Overview
Small Wire Bonding Tools
Large Wire Bonding Tools
Ribbon Wire Bonding Tool
Single Point-TAB Bonding Tools
Special Bonding Tools
Feel free to contact me for further information.

Die attach (i.e. IGBT, power LED, laser bars, MEMS, flip chip)
Substrate soldering for power modules
Wafer level packaging
Wafer bump reflow
Package sealing
T/R modules
Sintering
Alloying